Antec VSK3000B-U3 Mini Tower mATX USB3.0 1x92mm Fan Black 173x393x365mm

Antec VSK3000B-U3 Micro-ATX Mid-Tower Case - Black (0761345920254)

The Antec VSK3000B-U3 is a professional-grade Micro-ATX chassis engineered to provide a reliable and space-efficient foundation for business and corporate computing environments. This hardware features a robust SGCC (Galvanized Steel) construction, designed to ensure structural longevity and electromagnetic interference (EMI) shielding. The internal architecture is optimized for Micro-ATX and Mini-ITX motherboards, supporting high-density hardware configurations within a compact mechanical footprint. For thermal management, the chassis includes a pre-installed 92mm rear exhaust fan and specialized side-panel air guides to facilitate directional airflow across the processor and voltage regulator modules. The unit incorporates multiple drive bays for mechanical HDDs and solid-state storage, along with a high-speed USB 3.0 front-panel interface for rapid data transfer. Its industrial aesthetic is finished in a low-reflection matte black, adhering to standardized professional office and workstation hardware requirements.

Technical Specifications

* Model: VSK3000B-U3

* Part Number: 0-761345-92025-4

* EAN: 0761345920254

* Case Type: Micro-ATX Mid-Tower

* Dimensions: 365 x 173 x 393 mm

* Materials: SGCC Steel Frame / Plastic Bezel

* Motherboard Support: Micro-ATX, Mini-ITX

* GPU Length Clearance: Up to 318 mm

* CPU Cooler Height Clearance: Up to 145 mm

* Drive Bays: 1x 5.25" External, 1x 3.5" External, 2x 3.5" Internal, 1x 2.5" Internal

* Expansion Slots: 4

* I/O Ports: 1x USB 3.0, 1x USB 2.0, Audio In/Out

* Fan Support: Front: 1x 120mm; Rear: 1x 92mm (Included)

* Power Supply Support: Standard ATX (Top Mounted)

Key Features

* Thermally-Advantaged SGCC Architecture: Manufactured with heavy-duty galvanized steel that provides superior structural rigidity and heat dissipation properties for long-term operational stability.

* High-Speed USB 3.0 Interface: Equipped with a localized front-panel SuperSpeed USB port, enabling 5Gbps data signaling for professional external storage and high-bandwidth peripherals.

* Precision Airflow Integration: Features a pre-installed 92mm temperature-controlled exhaust fan and a perforated side-panel intake, engineered to maintain optimal thermal gradients within the hardware chamber.

* Versatile Storage Array: Designed with a modular internal layout that supports a combination of legacy 3.5-inch mechanical drives and modern 2.5-inch solid-state hardware for diverse data redundancy configurations.

* Industrial Tool-Less Compatibility: Features rolled internal edges and a standardized mechanical layout to facilitate safe hardware installation and maintenance cycles in high-volume deployment scenarios.