ARCTIC ACPCC00018A Xtender E-ATX PC case mirror black

Arctic MX-4 (4g) Performance Thermal Paste with Spatula (ACPCC00018A)

The Arctic MX-4 (ACPCC00018A) is a premium carbon-based thermal compound designed to provide exceptional heat dissipation for CPUs, GPUs, and other semiconductor components. Renowned for its consistency and long-term stability, this 4g syringe is the preferred choice for both professional system builders and overclocking enthusiasts. Unlike metal-based or silver-liquid compounds, the MX-4 is completely metal-free and non-electrically conductive, eliminating any risk of short-circuiting sensitive electronic components if the paste comes into contact with pins or traces. Its optimal viscosity allows for easy application and ensures an ultra-thin layer between the processor and the heatsink, filling microscopic imperfections to maximize thermal transfer. With a durability rating of up to 8 years once applied, the MX-4 ensures sustained cooling performance without the need for frequent re-application.

Technical Specifications

* Weight: 4 g (Syringe Content).

* Thermal Conductivity: High-performance Carbon-based.

* Viscosity: 870 poise.

* Density: 2.50 g/cm³.

* Volume Resistivity: 3.8 x 10^13 Ω-cm.

* Continuous Use Temperature: -50°C to 150°C.

* Electrical Conductivity: Non-conductive.

* Capacitive: Non-capacitive.

* Color: Grey.

* Application Tool: Included Spatula.

* Durability: Up to 8 years.

* Part Number: ACPCC00018A.

High-Efficiency Thermal Features

* Safe Application: Being non-electrically conductive and non-capacitive, it is completely safe to use on any component, making it beginner-friendly while maintaining professional-grade performance.

* Easy to Apply: The specific viscosity of the MX-4 is engineered to be spread easily using the included spatula or through the pressure of the heatsink, ensuring a perfect interface without air bubbles.

* Long-Term Stability: Unlike many silicone-based thermal greases, the MX-4 does not bleed or dry out over time, maintaining its thermal conductivity and structural integrity for years of continuous operation.

* Universal Compatibility: Optimized for use with high-performance air coolers and liquid cooling systems, effectively lowering temperatures for high-TDP processors from both Intel and AMD.