Sapphire EDGE AI 370 4H020-02-40G: AMD Ryzen AI 9 HX 370 12C/24T Radeon 890M 50 TOPS NPU Barebone Mini PC
- AMD Ryzen AI 9 HX 370 processor: 12 cores / 24 threads, up to 5.1 GHz
- Integrated AMD Radeon 890M graphics with RDNA 3.5 architecture
- 50 TOPS NPU for AI acceleration
- Supports up to 64GB DDR5 dual-channel RAM (SO-DIMM)
- Dual PCIe 4.0 M.2 slots for NVMe SSDs
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AMD Ryzen AI 9 HX 370 processor: 12 cores (4 Zen 5 + 8 Zen 5c) and 24 threads with boost up to 5.1 GHz (base 2.0-3.3 GHz), 36 MB total cache and 4 nm lithography, configurable TDP 15-54 W for extreme AI loads and sustained rendering.
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50 TOPS XDNA 2 NPU: Leading neural accelerator (up to 80+ TOPS system), Copilot+ PC certified for local LLMs inference, image generation and AI video processing without relying on the cloud.
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AMD Radeon 890M graphics: 16 RDNA 3.5 Compute Units at up to 2.9 GHz, viable 1440p gaming (60+ AAA optimised FPS), 8K editing and up to 4 4K displays via dual HDMI 2.1 + DP.
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DDR5 memory up to 96 GB: Dual-channel SO-DIMM DDR5-5600 (2 slots), massive bandwidth for large AI datasets, heavy virtualisation and complex simulations.
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Dual PCIe 4.0 storage: M.2 2280 + 2242 NVMe for ultra-fast SSDs (>7000 MB/s), plus M.2 2230 Wi-Fi, enabling RAID0/1 for massive projects.
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Workstation connectivity: 2x USB4 (40 Gbps), 4x USB 3.2 Gen2 (10 Gbps), 1x USB 2.0, 2.5GbE Ethernet, Wi-Fi 6E + Bluetooth 5.2, audio combo and VESA 30 mm for monitor mounting.
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Compact premium design: 117 x 111 x 30 mm (~0.4L), robust black/gold chassis, cooling up to 45 W silent, 120 W external power supply for 24/7 industrial operation.
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Fully customisable Barebones: No RAM/SSD/OS (Windows/Linux compatible), BIOS with TDP/AI/overclock profiles, tool-less design for quick upgrades.
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Edge AI efficiency: Intelligent Precision Boost and low power consumption, ideal for smart kiosks, remote servers or edge computing without data centres.
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Pro features: Secure Processor, PCIe 4.0/5.0 ready, AVX512 and modularity for future-proofing in generative AI, VFX and scientific simulations.
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ConectividadWiFi 6E, Bluetooth 5.2
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Memoria RAM2x SO-DIMM DDR5 (máx. 64 GB)
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Almacenamiento1x M.2 NVMe PCIe 4.0
| Brand | Sapphire |
|---|---|
| Country | China |
| Address of origin | Unit 1910–1919, 19/F., Tower 2, Grand Central Plaza, 138 Shatin Rural Committee Road, Shatin, N.T., Hong Kong |
| EU responsible person | Newstri Corporate Solutions SL |
| Address | Calle Pedro Duque,1 Módulo 6B 28814 Daganzo de Arriba - Madrid |
| [email protected] | |
| Phone | +34 912844705 |
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